NXP恩智浦半导体应用手册

AN10439 晶圆级芯片封装

keywords 关键字

wafer,level,chip-scale,chip-size,package,WLCSP

摘要

This application note provides guidelines for the use of Wafer Level Chip Size Packages (WLCSP). For information on printed circuit board (PCB),footprint design and reflow soldering see application note AN10365 (Surface mount reflow soldering description).

该应用手册可作为晶圆级芯片大小封装（Wafer Level Chip Size Packages (WLCSP)）的使用指导。关于PCB印刷电路板引脚以及焊接的相关内容，请参考应用手册AN10365。

AN10439 晶圆级芯片封装.PDF

AN10897 ESD和EMC设计指导

keywords 关键字

ESD,EMC,PCB design

摘要

An introductory approach to designing for ESD. Understanding the ESD pulse, how passive components react over frequency, and PCB layout techniques are exposed.

本文档介绍了ESD的设计。详细介绍了ESD脉冲、被动器件对频率的反应、PCB布局等。

AN10897 ESD和EMC设计指导.PDF

AN10436 TDA8932B/33(B) Class-D 音频放大器

keywords 关键字

Class-D amplifier,High efficiency,Switch mode amplifier,Flat TV,平板电视

摘要

This application note describes a stereo Switched Mode Amplifier (SMA) for audio, based on either the TDA8932B or TDA8933(B) Class-D audio amplifier device of NXP Semiconductors, which has been designed for Flat TV applications.

该应用手册详细描述了基于NXP TDA8932B 或者 TDA8933(B) Class-D 器件的立体声音频放大器。NXP恩智浦半导体该产品已经设计应用于平板电视。

AN10436 TDA8932B/33(B) Class-D 音频放大器.PDF